Demonstration of
sub-surface 3-D imaging capability
With the recent
development of improved 3D imaging, ARP’s terahertz scanner is now capable of “seeing”
inside of wafers and other opaque substrates. A scanning image is generated pinpointing location and size of particulate, void, and other defects. In addition, defect
size is quantified by to-the-scale direct measurements. It also visualizes the defects on the nanometer scale. As example is shown in Fig.1 and Fig.2 shows
a 360° view of the same.
Fig. 1. Snap shot of patterns on a wafer (not in
scale).
Fig. 2. A 360° inside view of the object in Fig. 1.
The terahertz sub-surface scanner from ARP is a
user friendly, easy to use machine. All
operations are automated via included software.
The machine exhibits an unprecedented resolution of a few nanometers in
3 axial directions. Yet scanning is
fast. Screen shot of measurement console
shown in Fig. 3. All parameters are
entered by the front-end interface.
Measured data are accessible for further manipulations.
Fig. 3. Screen shot of measurement
console.
Contact information:
For more information, please contact:
